JPS5129399B1 - - Google Patents
Info
- Publication number
- JPS5129399B1 JPS5129399B1 JP45089013A JP8901370A JPS5129399B1 JP S5129399 B1 JPS5129399 B1 JP S5129399B1 JP 45089013 A JP45089013 A JP 45089013A JP 8901370 A JP8901370 A JP 8901370A JP S5129399 B1 JPS5129399 B1 JP S5129399B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45089013A JPS5129399B1 (en) | 1970-10-09 | 1970-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45089013A JPS5129399B1 (en) | 1970-10-09 | 1970-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5129399B1 true JPS5129399B1 (en) | 1976-08-25 |
Family
ID=13959014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45089013A Pending JPS5129399B1 (en) | 1970-10-09 | 1970-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5129399B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51133898A (en) * | 1975-04-14 | 1976-11-19 | Garconnet Michel J | Tool for use in fastening and fastening |
| JPS5319197U (en) * | 1976-07-29 | 1978-02-18 | ||
| JPS5319198U (en) * | 1976-07-29 | 1978-02-18 |
-
1970
- 1970-10-09 JP JP45089013A patent/JPS5129399B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51133898A (en) * | 1975-04-14 | 1976-11-19 | Garconnet Michel J | Tool for use in fastening and fastening |
| JPS5319197U (en) * | 1976-07-29 | 1978-02-18 | ||
| JPS5319198U (en) * | 1976-07-29 | 1978-02-18 |