JPS5128960U - - Google Patents

Info

Publication number
JPS5128960U
JPS5128960U JP1974101220U JP10122074U JPS5128960U JP S5128960 U JPS5128960 U JP S5128960U JP 1974101220 U JP1974101220 U JP 1974101220U JP 10122074 U JP10122074 U JP 10122074U JP S5128960 U JPS5128960 U JP S5128960U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974101220U
Other versions
JPS5512431Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974101220U priority Critical patent/JPS5512431Y2/ja
Publication of JPS5128960U publication Critical patent/JPS5128960U/ja
Application granted granted Critical
Publication of JPS5512431Y2 publication Critical patent/JPS5512431Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]
JP1974101220U 1974-08-26 1974-08-26 Expired JPS5512431Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974101220U JPS5512431Y2 (ja) 1974-08-26 1974-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974101220U JPS5512431Y2 (ja) 1974-08-26 1974-08-26

Publications (2)

Publication Number Publication Date
JPS5128960U true JPS5128960U (ja) 1976-03-02
JPS5512431Y2 JPS5512431Y2 (ja) 1980-03-18

Family

ID=28307769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974101220U Expired JPS5512431Y2 (ja) 1974-08-26 1974-08-26

Country Status (1)

Country Link
JP (1) JPS5512431Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1979000302A1 (en) * 1977-11-18 1979-05-31 Fujitsu Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1979000302A1 (en) * 1977-11-18 1979-05-31 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5512431Y2 (ja) 1980-03-18

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