JPS5128561B1 - - Google Patents
Info
- Publication number
- JPS5128561B1 JPS5128561B1 JP42035899A JP3589967A JPS5128561B1 JP S5128561 B1 JPS5128561 B1 JP S5128561B1 JP 42035899 A JP42035899 A JP 42035899A JP 3589967 A JP3589967 A JP 3589967A JP S5128561 B1 JPS5128561 B1 JP S5128561B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP42035899A JPS5128561B1 (en) | 1967-06-05 | 1967-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP42035899A JPS5128561B1 (en) | 1967-06-05 | 1967-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5128561B1 true JPS5128561B1 (en) | 1976-08-20 |
Family
ID=12454856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP42035899A Pending JPS5128561B1 (en) | 1967-06-05 | 1967-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5128561B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11728238B2 (en) | 2019-07-29 | 2023-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package with heat dissipation films and manufacturing method thereof |
-
1967
- 1967-06-05 JP JP42035899A patent/JPS5128561B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11728238B2 (en) | 2019-07-29 | 2023-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package with heat dissipation films and manufacturing method thereof |