JPS5128502B2 - - Google Patents

Info

Publication number
JPS5128502B2
JPS5128502B2 JP47041075A JP4107572A JPS5128502B2 JP S5128502 B2 JPS5128502 B2 JP S5128502B2 JP 47041075 A JP47041075 A JP 47041075A JP 4107572 A JP4107572 A JP 4107572A JP S5128502 B2 JPS5128502 B2 JP S5128502B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47041075A
Other languages
Japanese (ja)
Other versions
JPS494480A (bg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47041075A priority Critical patent/JPS5128502B2/ja
Publication of JPS494480A publication Critical patent/JPS494480A/ja
Publication of JPS5128502B2 publication Critical patent/JPS5128502B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP47041075A 1972-04-24 1972-04-24 Expired JPS5128502B2 (bg)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47041075A JPS5128502B2 (bg) 1972-04-24 1972-04-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47041075A JPS5128502B2 (bg) 1972-04-24 1972-04-24

Publications (2)

Publication Number Publication Date
JPS494480A JPS494480A (bg) 1974-01-16
JPS5128502B2 true JPS5128502B2 (bg) 1976-08-19

Family

ID=12598315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47041075A Expired JPS5128502B2 (bg) 1972-04-24 1972-04-24

Country Status (1)

Country Link
JP (1) JPS5128502B2 (bg)

Also Published As

Publication number Publication date
JPS494480A (bg) 1974-01-16

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