JPS5128485A - - Google Patents

Info

Publication number
JPS5128485A
JPS5128485A JP49100877A JP10087774A JPS5128485A JP S5128485 A JPS5128485 A JP S5128485A JP 49100877 A JP49100877 A JP 49100877A JP 10087774 A JP10087774 A JP 10087774A JP S5128485 A JPS5128485 A JP S5128485A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49100877A
Other languages
Japanese (ja)
Inventor
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49100877A priority Critical patent/JPS5128485A/ja
Publication of JPS5128485A publication Critical patent/JPS5128485A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
JP49100877A 1974-09-04 1974-09-04 Pending JPS5128485A (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100877A JPS5128485A (OSRAM) 1974-09-04 1974-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100877A JPS5128485A (OSRAM) 1974-09-04 1974-09-04

Publications (1)

Publication Number Publication Date
JPS5128485A true JPS5128485A (OSRAM) 1976-03-10

Family

ID=14285539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100877A Pending JPS5128485A (OSRAM) 1974-09-04 1974-09-04

Country Status (1)

Country Link
JP (1) JPS5128485A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (ja) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp Fushigatahandotaisochinoseizohoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (ja) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp Fushigatahandotaisochinoseizohoho

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