JPS51270A - Banpuojusuru handotaisoshino setsuzokuhoho - Google Patents

Banpuojusuru handotaisoshino setsuzokuhoho

Info

Publication number
JPS51270A
JPS51270A JP49069889A JP6988974A JPS51270A JP S51270 A JPS51270 A JP S51270A JP 49069889 A JP49069889 A JP 49069889A JP 6988974 A JP6988974 A JP 6988974A JP S51270 A JPS51270 A JP S51270A
Authority
JP
Japan
Prior art keywords
setsuzokuhoho
handotaisoshino
banpuojusuru
handotaisoshino setsuzokuhoho
banpuojusuru handotaisoshino
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49069889A
Other languages
Japanese (ja)
Inventor
Masao Hayakawa
Takamichi Maeda
Masao Kumura
Masahiro Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP49069889A priority Critical patent/JPS51270A/en
Publication of JPS51270A publication Critical patent/JPS51270A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP49069889A 1974-06-18 1974-06-18 Banpuojusuru handotaisoshino setsuzokuhoho Pending JPS51270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49069889A JPS51270A (en) 1974-06-18 1974-06-18 Banpuojusuru handotaisoshino setsuzokuhoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49069889A JPS51270A (en) 1974-06-18 1974-06-18 Banpuojusuru handotaisoshino setsuzokuhoho

Publications (1)

Publication Number Publication Date
JPS51270A true JPS51270A (en) 1976-01-05

Family

ID=13415737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49069889A Pending JPS51270A (en) 1974-06-18 1974-06-18 Banpuojusuru handotaisoshino setsuzokuhoho

Country Status (1)

Country Link
JP (1) JPS51270A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597666A (en) * 1984-04-18 1986-07-01 The United States Of America As Represented By The Secretary Of The Navy Apparatus for determining the liquid water content of a gas

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597666A (en) * 1984-04-18 1986-07-01 The United States Of America As Represented By The Secretary Of The Navy Apparatus for determining the liquid water content of a gas

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