JPS5125963A - Handotaisochi no seizoho - Google Patents
Handotaisochi no seizohoInfo
- Publication number
- JPS5125963A JPS5125963A JP9790174A JP9790174A JPS5125963A JP S5125963 A JPS5125963 A JP S5125963A JP 9790174 A JP9790174 A JP 9790174A JP 9790174 A JP9790174 A JP 9790174A JP S5125963 A JPS5125963 A JP S5125963A
- Authority
- JP
- Japan
- Prior art keywords
- handotaisochi
- seizoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9790174A JPS5125963A (en) | 1974-08-28 | 1974-08-28 | Handotaisochi no seizoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9790174A JPS5125963A (en) | 1974-08-28 | 1974-08-28 | Handotaisochi no seizoho |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5125963A true JPS5125963A (en) | 1976-03-03 |
Family
ID=14204625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9790174A Pending JPS5125963A (en) | 1974-08-28 | 1974-08-28 | Handotaisochi no seizoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5125963A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05302495A (en) * | 1992-04-24 | 1993-11-16 | Fujita Corp | Shield method and shield machine |
-
1974
- 1974-08-28 JP JP9790174A patent/JPS5125963A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05302495A (en) * | 1992-04-24 | 1993-11-16 | Fujita Corp | Shield method and shield machine |
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