JPS5125962A - - Google Patents

Info

Publication number
JPS5125962A
JPS5125962A JP49098720A JP9872074A JPS5125962A JP S5125962 A JPS5125962 A JP S5125962A JP 49098720 A JP49098720 A JP 49098720A JP 9872074 A JP9872074 A JP 9872074A JP S5125962 A JPS5125962 A JP S5125962A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49098720A
Other languages
Japanese (ja)
Other versions
JPS5721859B2 (enrdf_load_stackoverflow
Inventor
Masanori Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9872074A priority Critical patent/JPS5721859B2/ja
Publication of JPS5125962A publication Critical patent/JPS5125962A/ja
Publication of JPS5721859B2 publication Critical patent/JPS5721859B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP9872074A 1974-08-27 1974-08-27 Expired JPS5721859B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9872074A JPS5721859B2 (enrdf_load_stackoverflow) 1974-08-27 1974-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9872074A JPS5721859B2 (enrdf_load_stackoverflow) 1974-08-27 1974-08-27

Publications (2)

Publication Number Publication Date
JPS5125962A true JPS5125962A (enrdf_load_stackoverflow) 1976-03-03
JPS5721859B2 JPS5721859B2 (enrdf_load_stackoverflow) 1982-05-10

Family

ID=14227342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9872074A Expired JPS5721859B2 (enrdf_load_stackoverflow) 1974-08-27 1974-08-27

Country Status (1)

Country Link
JP (1) JPS5721859B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187614U (enrdf_load_stackoverflow) * 1987-05-26 1988-12-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187614U (enrdf_load_stackoverflow) * 1987-05-26 1988-12-01

Also Published As

Publication number Publication date
JPS5721859B2 (enrdf_load_stackoverflow) 1982-05-10

Similar Documents

Publication Publication Date Title
FR2259251B3 (enrdf_load_stackoverflow)
JPS5721859B2 (enrdf_load_stackoverflow)
AU479230B2 (enrdf_load_stackoverflow)
AU495821B2 (enrdf_load_stackoverflow)
AU495844B2 (enrdf_load_stackoverflow)
AU7253374A (enrdf_load_stackoverflow)
AR201233Q (enrdf_load_stackoverflow)
AU6599874A (enrdf_load_stackoverflow)
BE829575A (enrdf_load_stackoverflow)
BG19673A1 (enrdf_load_stackoverflow)
AU480247A (enrdf_load_stackoverflow)
BG20164A1 (enrdf_load_stackoverflow)
AU480764A (enrdf_load_stackoverflow)
AU480783A (enrdf_load_stackoverflow)
AU480819A (enrdf_load_stackoverflow)
AU480879A (enrdf_load_stackoverflow)
AU481544A (enrdf_load_stackoverflow)
AU481639A (enrdf_load_stackoverflow)
AU481873A (enrdf_load_stackoverflow)
AU479683A (enrdf_load_stackoverflow)
AU482022A (enrdf_load_stackoverflow)
AU482244A (enrdf_load_stackoverflow)
AU482284A (enrdf_load_stackoverflow)
AU479472A (enrdf_load_stackoverflow)
BE830156A (enrdf_load_stackoverflow)