JPS512382A - - Google Patents

Info

Publication number
JPS512382A
JPS512382A JP49071313A JP7131374A JPS512382A JP S512382 A JPS512382 A JP S512382A JP 49071313 A JP49071313 A JP 49071313A JP 7131374 A JP7131374 A JP 7131374A JP S512382 A JPS512382 A JP S512382A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49071313A
Inventor
Takehiko Matsunaga
Keisuke Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49071313A priority Critical patent/JPS512382A/ja
Publication of JPS512382A publication Critical patent/JPS512382A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Wire Bonding (AREA)
JP49071313A 1974-06-24 1974-06-24 Pending JPS512382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49071313A JPS512382A (ja) 1974-06-24 1974-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49071313A JPS512382A (ja) 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
JPS512382A true JPS512382A (ja) 1976-01-09

Family

ID=13456984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49071313A Pending JPS512382A (ja) 1974-06-24 1974-06-24

Country Status (1)

Country Link
JP (1) JPS512382A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185053A (ja) * 1989-01-12 1990-07-19 Shinko Electric Ind Co Ltd フリップチップボンディング用基板
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board
JP2004031474A (ja) * 2002-06-24 2004-01-29 Tdk Corp 電子部品及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185053A (ja) * 1989-01-12 1990-07-19 Shinko Electric Ind Co Ltd フリップチップボンディング用基板
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board
JP2004031474A (ja) * 2002-06-24 2004-01-29 Tdk Corp 電子部品及びその製造方法

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