JPS5123528U - - Google Patents

Info

Publication number
JPS5123528U
JPS5123528U JP9537574U JP9537574U JPS5123528U JP S5123528 U JPS5123528 U JP S5123528U JP 9537574 U JP9537574 U JP 9537574U JP 9537574 U JP9537574 U JP 9537574U JP S5123528 U JPS5123528 U JP S5123528U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9537574U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9537574U priority Critical patent/JPS5123528U/ja
Publication of JPS5123528U publication Critical patent/JPS5123528U/ja
Pending legal-status Critical Current

Links

JP9537574U 1974-08-12 1974-08-12 Pending JPS5123528U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9537574U JPS5123528U (ja) 1974-08-12 1974-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9537574U JPS5123528U (ja) 1974-08-12 1974-08-12

Publications (1)

Publication Number Publication Date
JPS5123528U true JPS5123528U (ja) 1976-02-20

Family

ID=28291293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9537574U Pending JPS5123528U (ja) 1974-08-12 1974-08-12

Country Status (1)

Country Link
JP (1) JPS5123528U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816770A (ja) * 1981-07-20 1983-01-31 Mitsubishi Metal Corp はんだぬれ性および耐溶融はんだ侵食性にすぐれた高強度高熱伝導性はんだごてチツプ
JPH0417974A (ja) * 1990-05-10 1992-01-22 Hakko Kk 半田用チップおよびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816770A (ja) * 1981-07-20 1983-01-31 Mitsubishi Metal Corp はんだぬれ性および耐溶融はんだ侵食性にすぐれた高強度高熱伝導性はんだごてチツプ
JPH0417974A (ja) * 1990-05-10 1992-01-22 Hakko Kk 半田用チップおよびその製造方法

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