JPS5123078A - Handotaisoshino denkyokukozo - Google Patents

Handotaisoshino denkyokukozo

Info

Publication number
JPS5123078A
JPS5123078A JP49096431A JP9643174A JPS5123078A JP S5123078 A JPS5123078 A JP S5123078A JP 49096431 A JP49096431 A JP 49096431A JP 9643174 A JP9643174 A JP 9643174A JP S5123078 A JPS5123078 A JP S5123078A
Authority
JP
Japan
Prior art keywords
handotaisoshino
denkyokukozo
handotaisoshino denkyokukozo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49096431A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5329548B2 (enrdf_load_stackoverflow
Inventor
Takeshi Umegaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP49096431A priority Critical patent/JPS5123078A/ja
Publication of JPS5123078A publication Critical patent/JPS5123078A/ja
Publication of JPS5329548B2 publication Critical patent/JPS5329548B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP49096431A 1974-08-20 1974-08-20 Handotaisoshino denkyokukozo Granted JPS5123078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49096431A JPS5123078A (en) 1974-08-20 1974-08-20 Handotaisoshino denkyokukozo

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49096431A JPS5123078A (en) 1974-08-20 1974-08-20 Handotaisoshino denkyokukozo

Publications (2)

Publication Number Publication Date
JPS5123078A true JPS5123078A (en) 1976-02-24
JPS5329548B2 JPS5329548B2 (enrdf_load_stackoverflow) 1978-08-22

Family

ID=14164802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49096431A Granted JPS5123078A (en) 1974-08-20 1974-08-20 Handotaisoshino denkyokukozo

Country Status (1)

Country Link
JP (1) JPS5123078A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138969A (enrdf_load_stackoverflow) * 1974-09-30 1976-03-31 Hitachi Ltd

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4848076A (enrdf_load_stackoverflow) * 1971-10-20 1973-07-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4848076A (enrdf_load_stackoverflow) * 1971-10-20 1973-07-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138969A (enrdf_load_stackoverflow) * 1974-09-30 1976-03-31 Hitachi Ltd

Also Published As

Publication number Publication date
JPS5329548B2 (enrdf_load_stackoverflow) 1978-08-22

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