JPS5119662U - - Google Patents
Info
- Publication number
- JPS5119662U JPS5119662U JP1974089788U JP8978874U JPS5119662U JP S5119662 U JPS5119662 U JP S5119662U JP 1974089788 U JP1974089788 U JP 1974089788U JP 8978874 U JP8978874 U JP 8978874U JP S5119662 U JPS5119662 U JP S5119662U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974089788U JPS5419824Y2 (cg-RX-API-DMAC7.html) | 1974-07-27 | 1974-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974089788U JPS5419824Y2 (cg-RX-API-DMAC7.html) | 1974-07-27 | 1974-07-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5119662U true JPS5119662U (cg-RX-API-DMAC7.html) | 1976-02-13 |
| JPS5419824Y2 JPS5419824Y2 (cg-RX-API-DMAC7.html) | 1979-07-20 |
Family
ID=28276381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974089788U Expired JPS5419824Y2 (cg-RX-API-DMAC7.html) | 1974-07-27 | 1974-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5419824Y2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63161693U (cg-RX-API-DMAC7.html) * | 1987-04-08 | 1988-10-21 |
-
1974
- 1974-07-27 JP JP1974089788U patent/JPS5419824Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63161693U (cg-RX-API-DMAC7.html) * | 1987-04-08 | 1988-10-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5419824Y2 (cg-RX-API-DMAC7.html) | 1979-07-20 |