JPS5116702Y2 - - Google Patents

Info

Publication number
JPS5116702Y2
JPS5116702Y2 JP1972124829U JP12482972U JPS5116702Y2 JP S5116702 Y2 JPS5116702 Y2 JP S5116702Y2 JP 1972124829 U JP1972124829 U JP 1972124829U JP 12482972 U JP12482972 U JP 12482972U JP S5116702 Y2 JPS5116702 Y2 JP S5116702Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972124829U
Other languages
Japanese (ja)
Other versions
JPS4980162U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972124829U priority Critical patent/JPS5116702Y2/ja
Publication of JPS4980162U publication Critical patent/JPS4980162U/ja
Application granted granted Critical
Publication of JPS5116702Y2 publication Critical patent/JPS5116702Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1972124829U 1972-10-27 1972-10-27 Expired JPS5116702Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972124829U JPS5116702Y2 (fr) 1972-10-27 1972-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972124829U JPS5116702Y2 (fr) 1972-10-27 1972-10-27

Publications (2)

Publication Number Publication Date
JPS4980162U JPS4980162U (fr) 1974-07-11
JPS5116702Y2 true JPS5116702Y2 (fr) 1976-05-06

Family

ID=28374156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972124829U Expired JPS5116702Y2 (fr) 1972-10-27 1972-10-27

Country Status (1)

Country Link
JP (1) JPS5116702Y2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576389B (zh) * 2012-07-24 2017-04-01 三菱瓦斯化學股份有限公司 熱可塑性樹脂組成物及利用此組成物之片材

Also Published As

Publication number Publication date
JPS4980162U (fr) 1974-07-11

Similar Documents

Publication Publication Date Title
JPS5116506Y2 (fr)
JPS4968654U (fr)
CH564362A5 (fr)
CH559345A5 (fr)
BG18529A1 (fr)
BG18669A1 (fr)
CH1117073A4 (fr)
CH1117273A4 (fr)
CH1225572A4 (fr)
CH338272A4 (fr)
CH36570A4 (fr)
CH565480A5 (fr)
CH564778A5 (fr)
BG17925A1 (fr)
CH559948A5 (fr)
CH560773A5 (fr)
CH560870A5 (fr)
CH561297A5 (fr)
CH562120A5 (fr)
CH562416A5 (fr)
CH562592A5 (fr)
CH562680A5 (fr)
CH562786A5 (fr)
CH563592A5 (fr)
BG18226A1 (fr)