JPS5116702Y2 - - Google Patents
Info
- Publication number
- JPS5116702Y2 JPS5116702Y2 JP1972124829U JP12482972U JPS5116702Y2 JP S5116702 Y2 JPS5116702 Y2 JP S5116702Y2 JP 1972124829 U JP1972124829 U JP 1972124829U JP 12482972 U JP12482972 U JP 12482972U JP S5116702 Y2 JPS5116702 Y2 JP S5116702Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972124829U JPS5116702Y2 (en:Method) | 1972-10-27 | 1972-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972124829U JPS5116702Y2 (en:Method) | 1972-10-27 | 1972-10-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4980162U JPS4980162U (en:Method) | 1974-07-11 |
| JPS5116702Y2 true JPS5116702Y2 (en:Method) | 1976-05-06 |
Family
ID=28374156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972124829U Expired JPS5116702Y2 (en:Method) | 1972-10-27 | 1972-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5116702Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576389B (zh) * | 2012-07-24 | 2017-04-01 | 三菱瓦斯化學股份有限公司 | 熱可塑性樹脂組成物及利用此組成物之片材 |
-
1972
- 1972-10-27 JP JP1972124829U patent/JPS5116702Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4980162U (en:Method) | 1974-07-11 |