JPS5116308B2 - - Google Patents

Info

Publication number
JPS5116308B2
JPS5116308B2 JP47108119A JP10811972A JPS5116308B2 JP S5116308 B2 JPS5116308 B2 JP S5116308B2 JP 47108119 A JP47108119 A JP 47108119A JP 10811972 A JP10811972 A JP 10811972A JP S5116308 B2 JPS5116308 B2 JP S5116308B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47108119A
Other versions
JPS4966076A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47108119A priority Critical patent/JPS5116308B2/ja
Publication of JPS4966076A publication Critical patent/JPS4966076A/ja
Publication of JPS5116308B2 publication Critical patent/JPS5116308B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP47108119A 1972-10-27 1972-10-27 Expired JPS5116308B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47108119A JPS5116308B2 (ja) 1972-10-27 1972-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47108119A JPS5116308B2 (ja) 1972-10-27 1972-10-27

Publications (2)

Publication Number Publication Date
JPS4966076A JPS4966076A (ja) 1974-06-26
JPS5116308B2 true JPS5116308B2 (ja) 1976-05-22

Family

ID=14476388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47108119A Expired JPS5116308B2 (ja) 1972-10-27 1972-10-27

Country Status (1)

Country Link
JP (1) JPS5116308B2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5490688A (en) * 1977-12-28 1979-07-18 Amada Co Ltd Grinding working device

Also Published As

Publication number Publication date
JPS4966076A (ja) 1974-06-26

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