JPS5116292B2 - - Google Patents
Info
- Publication number
- JPS5116292B2 JPS5116292B2 JP8457772A JP8457772A JPS5116292B2 JP S5116292 B2 JPS5116292 B2 JP S5116292B2 JP 8457772 A JP8457772 A JP 8457772A JP 8457772 A JP8457772 A JP 8457772A JP S5116292 B2 JPS5116292 B2 JP S5116292B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457772A JPS5116292B2 (sk) | 1972-08-25 | 1972-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8457772A JPS5116292B2 (sk) | 1972-08-25 | 1972-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4940869A JPS4940869A (sk) | 1974-04-17 |
| JPS5116292B2 true JPS5116292B2 (sk) | 1976-05-22 |
Family
ID=13834513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8457772A Expired JPS5116292B2 (sk) | 1972-08-25 | 1972-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5116292B2 (sk) |
-
1972
- 1972-08-25 JP JP8457772A patent/JPS5116292B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4940869A (sk) | 1974-04-17 |