JPS51162662U - - Google Patents
Info
- Publication number
- JPS51162662U JPS51162662U JP1975082088U JP8208875U JPS51162662U JP S51162662 U JPS51162662 U JP S51162662U JP 1975082088 U JP1975082088 U JP 1975082088U JP 8208875 U JP8208875 U JP 8208875U JP S51162662 U JPS51162662 U JP S51162662U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975082088U JPS51162662U (he) | 1975-06-18 | 1975-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975082088U JPS51162662U (he) | 1975-06-18 | 1975-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51162662U true JPS51162662U (he) | 1976-12-24 |
Family
ID=28562311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975082088U Pending JPS51162662U (he) | 1975-06-18 | 1975-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51162662U (he) |
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1975
- 1975-06-18 JP JP1975082088U patent/JPS51162662U/ja active Pending