JPS51160063U - - Google Patents
Info
- Publication number
- JPS51160063U JPS51160063U JP1975079467U JP7946775U JPS51160063U JP S51160063 U JPS51160063 U JP S51160063U JP 1975079467 U JP1975079467 U JP 1975079467U JP 7946775 U JP7946775 U JP 7946775U JP S51160063 U JPS51160063 U JP S51160063U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975079467U JPS51160063U (enExample) | 1975-06-13 | 1975-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975079467U JPS51160063U (enExample) | 1975-06-13 | 1975-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51160063U true JPS51160063U (enExample) | 1976-12-20 |
Family
ID=28557323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975079467U Pending JPS51160063U (enExample) | 1975-06-13 | 1975-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51160063U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120658A (en) * | 1977-03-30 | 1978-10-21 | Seiko Epson Corp | Improved brazing filler metal |
-
1975
- 1975-06-13 JP JP1975079467U patent/JPS51160063U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120658A (en) * | 1977-03-30 | 1978-10-21 | Seiko Epson Corp | Improved brazing filler metal |