JPS5115973A - - Google Patents
Info
- Publication number
- JPS5115973A JPS5115973A JP49087000A JP8700074A JPS5115973A JP S5115973 A JPS5115973 A JP S5115973A JP 49087000 A JP49087000 A JP 49087000A JP 8700074 A JP8700074 A JP 8700074A JP S5115973 A JPS5115973 A JP S5115973A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49087000A JPS5115973A (enExample) | 1974-07-31 | 1974-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49087000A JPS5115973A (enExample) | 1974-07-31 | 1974-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5115973A true JPS5115973A (enExample) | 1976-02-07 |
Family
ID=13902593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49087000A Pending JPS5115973A (enExample) | 1974-07-31 | 1974-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5115973A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60117760A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | 浸漬液冷装置 |
| US4974769A (en) * | 1988-04-28 | 1990-12-04 | Hitachi, Ltd. | Method of joining composite structures |
| US7851903B2 (en) | 2007-06-04 | 2010-12-14 | Showa Optronics Co., Ltd. | Infrared detector with plurality of metallization between first and second container members |
-
1974
- 1974-07-31 JP JP49087000A patent/JPS5115973A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60117760A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | 浸漬液冷装置 |
| US4974769A (en) * | 1988-04-28 | 1990-12-04 | Hitachi, Ltd. | Method of joining composite structures |
| US7851903B2 (en) | 2007-06-04 | 2010-12-14 | Showa Optronics Co., Ltd. | Infrared detector with plurality of metallization between first and second container members |