JPS5115972A - - Google Patents

Info

Publication number
JPS5115972A
JPS5115972A JP49087764A JP8776474A JPS5115972A JP S5115972 A JPS5115972 A JP S5115972A JP 49087764 A JP49087764 A JP 49087764A JP 8776474 A JP8776474 A JP 8776474A JP S5115972 A JPS5115972 A JP S5115972A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49087764A
Other languages
Japanese (ja)
Inventor
Katsuyuki Kawase
Mutsumi Sato
Kuniaki Hamada
Seiji Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Nippon Electric Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP49087764A priority Critical patent/JPS5115972A/ja
Priority to US05/517,307 priority patent/US3941985A/en
Publication of JPS5115972A publication Critical patent/JPS5115972A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP49087764A 1973-10-25 1974-07-30 Pending JPS5115972A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP49087764A JPS5115972A (en) 1974-07-30 1974-07-30
US05/517,307 US3941985A (en) 1973-10-25 1974-10-23 Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49087764A JPS5115972A (en) 1974-07-30 1974-07-30

Publications (1)

Publication Number Publication Date
JPS5115972A true JPS5115972A (en) 1976-02-07

Family

ID=13924011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49087764A Pending JPS5115972A (en) 1973-10-25 1974-07-30

Country Status (1)

Country Link
JP (1) JPS5115972A (en)

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