JPS5115858U - - Google Patents
Info
- Publication number
- JPS5115858U JPS5115858U JP8824974U JP8824974U JPS5115858U JP S5115858 U JPS5115858 U JP S5115858U JP 8824974 U JP8824974 U JP 8824974U JP 8824974 U JP8824974 U JP 8824974U JP S5115858 U JPS5115858 U JP S5115858U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8824974U JPS5437264Y2 (en) | 1974-07-23 | 1974-07-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8824974U JPS5437264Y2 (en) | 1974-07-23 | 1974-07-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5115858U true JPS5115858U (en) | 1976-02-05 |
JPS5437264Y2 JPS5437264Y2 (en) | 1979-11-08 |
Family
ID=28273012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8824974U Expired JPS5437264Y2 (en) | 1974-07-23 | 1974-07-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5437264Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4995316U (en) * | 1972-12-14 | 1974-08-16 | ||
JP2014120759A (en) * | 2012-12-13 | 2014-06-30 | Samsung Electro-Mechanics Co Ltd | Common mode filter and method of manufacturing the same |
-
1974
- 1974-07-23 JP JP8824974U patent/JPS5437264Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4995316U (en) * | 1972-12-14 | 1974-08-16 | ||
JP2014120759A (en) * | 2012-12-13 | 2014-06-30 | Samsung Electro-Mechanics Co Ltd | Common mode filter and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5437264Y2 (en) | 1979-11-08 |