JPS51156763U - - Google Patents
Info
- Publication number
- JPS51156763U JPS51156763U JP1975062329U JP6232975U JPS51156763U JP S51156763 U JPS51156763 U JP S51156763U JP 1975062329 U JP1975062329 U JP 1975062329U JP 6232975 U JP6232975 U JP 6232975U JP S51156763 U JPS51156763 U JP S51156763U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975062329U JPS51156763U (enExample) | 1975-05-07 | 1975-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975062329U JPS51156763U (enExample) | 1975-05-07 | 1975-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51156763U true JPS51156763U (enExample) | 1976-12-14 |
Family
ID=28524603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975062329U Pending JPS51156763U (enExample) | 1975-05-07 | 1975-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51156763U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| US7589399B2 (en) | 2005-08-26 | 2009-09-15 | Sharp Kabushiki Kaisha | Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4835269B1 (enExample) * | 1970-12-26 | 1973-10-26 |
-
1975
- 1975-05-07 JP JP1975062329U patent/JPS51156763U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4835269B1 (enExample) * | 1970-12-26 | 1973-10-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| US7589399B2 (en) | 2005-08-26 | 2009-09-15 | Sharp Kabushiki Kaisha | Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device |