JPS51155070U - - Google Patents
Info
- Publication number
- JPS51155070U JPS51155070U JP1975076674U JP7667475U JPS51155070U JP S51155070 U JPS51155070 U JP S51155070U JP 1975076674 U JP1975076674 U JP 1975076674U JP 7667475 U JP7667475 U JP 7667475U JP S51155070 U JPS51155070 U JP S51155070U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Thyristors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975076674U JPS5716376Y2 (enExample) | 1975-06-05 | 1975-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975076674U JPS5716376Y2 (enExample) | 1975-06-05 | 1975-06-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51155070U true JPS51155070U (enExample) | 1976-12-10 |
| JPS5716376Y2 JPS5716376Y2 (enExample) | 1982-04-06 |
Family
ID=28551888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975076674U Expired JPS5716376Y2 (enExample) | 1975-06-05 | 1975-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5716376Y2 (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910463U (enExample) * | 1972-04-28 | 1974-01-29 |
-
1975
- 1975-06-05 JP JP1975076674U patent/JPS5716376Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910463U (enExample) * | 1972-04-28 | 1974-01-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5716376Y2 (enExample) | 1982-04-06 |