JPS51151575U - - Google Patents

Info

Publication number
JPS51151575U
JPS51151575U JP7222775U JP7222775U JPS51151575U JP S51151575 U JPS51151575 U JP S51151575U JP 7222775 U JP7222775 U JP 7222775U JP 7222775 U JP7222775 U JP 7222775U JP S51151575 U JPS51151575 U JP S51151575U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7222775U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7222775U priority Critical patent/JPS51151575U/ja
Publication of JPS51151575U publication Critical patent/JPS51151575U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
JP7222775U 1975-05-28 1975-05-28 Pending JPS51151575U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7222775U JPS51151575U (ja) 1975-05-28 1975-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7222775U JPS51151575U (ja) 1975-05-28 1975-05-28

Publications (1)

Publication Number Publication Date
JPS51151575U true JPS51151575U (ja) 1976-12-03

Family

ID=28543346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7222775U Pending JPS51151575U (ja) 1975-05-28 1975-05-28

Country Status (1)

Country Link
JP (1) JPS51151575U (ja)

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