JPS51142245A - Elastic surface-wave device - Google Patents

Elastic surface-wave device

Info

Publication number
JPS51142245A
JPS51142245A JP6602275A JP6602275A JPS51142245A JP S51142245 A JPS51142245 A JP S51142245A JP 6602275 A JP6602275 A JP 6602275A JP 6602275 A JP6602275 A JP 6602275A JP S51142245 A JPS51142245 A JP S51142245A
Authority
JP
Japan
Prior art keywords
wave device
elastic surface
elastic
wave
cheaply constructed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6602275A
Other languages
Japanese (ja)
Other versions
JPS5827687B2 (en
Inventor
Shozo Takeno
Koichiro Wakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP50066022A priority Critical patent/JPS5827687B2/en
Publication of JPS51142245A publication Critical patent/JPS51142245A/en
Publication of JPS5827687B2 publication Critical patent/JPS5827687B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/0585—Holders or supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:An elastic surface-wave device which can be cheaply constructed.
JP50066022A 1975-06-03 1975-06-03 Dansei Hiyoumenhasouchi Expired JPS5827687B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50066022A JPS5827687B2 (en) 1975-06-03 1975-06-03 Dansei Hiyoumenhasouchi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50066022A JPS5827687B2 (en) 1975-06-03 1975-06-03 Dansei Hiyoumenhasouchi

Publications (2)

Publication Number Publication Date
JPS51142245A true JPS51142245A (en) 1976-12-07
JPS5827687B2 JPS5827687B2 (en) 1983-06-10

Family

ID=13303873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50066022A Expired JPS5827687B2 (en) 1975-06-03 1975-06-03 Dansei Hiyoumenhasouchi

Country Status (1)

Country Link
JP (1) JPS5827687B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443442A (en) * 1977-09-12 1979-04-06 Nippon Denpa Kogyo Kk Elastic surface wave unit
JPS5696706U (en) * 1979-12-24 1981-07-31
JPS5734603U (en) * 1980-07-28 1982-02-23
JPS59141811A (en) * 1983-02-01 1984-08-14 Toyo Commun Equip Co Ltd Package of piezoelectric device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153845U (en) * 1974-10-22 1976-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153845U (en) * 1974-10-22 1976-04-24

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443442A (en) * 1977-09-12 1979-04-06 Nippon Denpa Kogyo Kk Elastic surface wave unit
JPS5696706U (en) * 1979-12-24 1981-07-31
JPS5734603U (en) * 1980-07-28 1982-02-23
JPS59141811A (en) * 1983-02-01 1984-08-14 Toyo Commun Equip Co Ltd Package of piezoelectric device

Also Published As

Publication number Publication date
JPS5827687B2 (en) 1983-06-10

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