JPS51142033U - - Google Patents
Info
- Publication number
- JPS51142033U JPS51142033U JP6196275U JP6196275U JPS51142033U JP S51142033 U JPS51142033 U JP S51142033U JP 6196275 U JP6196275 U JP 6196275U JP 6196275 U JP6196275 U JP 6196275U JP S51142033 U JPS51142033 U JP S51142033U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Straightening Metal Sheet-Like Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6196275U JPS533228Y2 (en) | 1975-05-09 | 1975-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6196275U JPS533228Y2 (en) | 1975-05-09 | 1975-05-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51142033U true JPS51142033U (en) | 1976-11-16 |
JPS533228Y2 JPS533228Y2 (en) | 1978-01-27 |
Family
ID=28523902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6196275U Expired JPS533228Y2 (en) | 1975-05-09 | 1975-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS533228Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005238302A (en) * | 2004-02-27 | 2005-09-08 | Nippon Mining & Metals Co Ltd | Method for joining electrolytic copper plate manufactured by permanent cathode method and joining apparatus using the same |
-
1975
- 1975-05-09 JP JP6196275U patent/JPS533228Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005238302A (en) * | 2004-02-27 | 2005-09-08 | Nippon Mining & Metals Co Ltd | Method for joining electrolytic copper plate manufactured by permanent cathode method and joining apparatus using the same |
JP4490135B2 (en) * | 2004-02-27 | 2010-06-23 | 日鉱金属株式会社 | Bonding method and bonding apparatus using electric copper plate manufactured by permanent cathode method |
Also Published As
Publication number | Publication date |
---|---|
JPS533228Y2 (en) | 1978-01-27 |