JPS5113622B2 - - Google Patents

Info

Publication number
JPS5113622B2
JPS5113622B2 JP8560172A JP8560172A JPS5113622B2 JP S5113622 B2 JPS5113622 B2 JP S5113622B2 JP 8560172 A JP8560172 A JP 8560172A JP 8560172 A JP8560172 A JP 8560172A JP S5113622 B2 JPS5113622 B2 JP S5113622B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8560172A
Other versions
JPS4941070A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8560172A priority Critical patent/JPS5113622B2/ja
Publication of JPS4941070A publication Critical patent/JPS4941070A/ja
Publication of JPS5113622B2 publication Critical patent/JPS5113622B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8560172A 1972-08-25 1972-08-25 Expired JPS5113622B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8560172A JPS5113622B2 (ja) 1972-08-25 1972-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8560172A JPS5113622B2 (ja) 1972-08-25 1972-08-25

Publications (2)

Publication Number Publication Date
JPS4941070A JPS4941070A (ja) 1974-04-17
JPS5113622B2 true JPS5113622B2 (ja) 1976-05-01

Family

ID=13863332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8560172A Expired JPS5113622B2 (ja) 1972-08-25 1972-08-25

Country Status (1)

Country Link
JP (1) JPS5113622B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322521U (ja) * 1976-08-05 1978-02-25
JPH0732122U (ja) * 1992-12-15 1995-06-16 月星工業株式会社 自走式駐車場のノンスリップ パネル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322521U (ja) * 1976-08-05 1978-02-25
JPH0732122U (ja) * 1992-12-15 1995-06-16 月星工業株式会社 自走式駐車場のノンスリップ パネル

Also Published As

Publication number Publication date
JPS4941070A (ja) 1974-04-17

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