JPS5113618B2 - - Google Patents
Info
- Publication number
- JPS5113618B2 JPS5113618B2 JP4159372A JP4159372A JPS5113618B2 JP S5113618 B2 JPS5113618 B2 JP S5113618B2 JP 4159372 A JP4159372 A JP 4159372A JP 4159372 A JP4159372 A JP 4159372A JP S5113618 B2 JPS5113618 B2 JP S5113618B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4159372A JPS5113618B2 (cg-RX-API-DMAC10.html) | 1972-04-25 | 1972-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4159372A JPS5113618B2 (cg-RX-API-DMAC10.html) | 1972-04-25 | 1972-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS494980A JPS494980A (cg-RX-API-DMAC10.html) | 1974-01-17 |
| JPS5113618B2 true JPS5113618B2 (cg-RX-API-DMAC10.html) | 1976-05-01 |
Family
ID=12612696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4159372A Expired JPS5113618B2 (cg-RX-API-DMAC10.html) | 1972-04-25 | 1972-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5113618B2 (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427507U (cg-RX-API-DMAC10.html) * | 1977-07-27 | 1979-02-22 | ||
| JPS6124513U (ja) * | 1984-07-20 | 1986-02-13 | 竹一 三根 | 内側締つけフツクボルト |
| JPS61137716U (cg-RX-API-DMAC10.html) * | 1985-02-16 | 1986-08-27 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0221766Y2 (cg-RX-API-DMAC10.html) * | 1980-04-02 | 1990-06-12 |
-
1972
- 1972-04-25 JP JP4159372A patent/JPS5113618B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427507U (cg-RX-API-DMAC10.html) * | 1977-07-27 | 1979-02-22 | ||
| JPS6124513U (ja) * | 1984-07-20 | 1986-02-13 | 竹一 三根 | 内側締つけフツクボルト |
| JPS61137716U (cg-RX-API-DMAC10.html) * | 1985-02-16 | 1986-08-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS494980A (cg-RX-API-DMAC10.html) | 1974-01-17 |