JPS5113611B2 - - Google Patents
Info
- Publication number
- JPS5113611B2 JPS5113611B2 JP335372A JP335372A JPS5113611B2 JP S5113611 B2 JPS5113611 B2 JP S5113611B2 JP 335372 A JP335372 A JP 335372A JP 335372 A JP335372 A JP 335372A JP S5113611 B2 JPS5113611 B2 JP S5113611B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP335372A JPS5113611B2 (cs) | 1971-12-23 | 1971-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP335372A JPS5113611B2 (cs) | 1971-12-23 | 1971-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4870478A JPS4870478A (cs) | 1973-09-25 |
| JPS5113611B2 true JPS5113611B2 (cs) | 1976-05-01 |
Family
ID=11554972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP335372A Expired JPS5113611B2 (cs) | 1971-12-23 | 1971-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5113611B2 (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092645A (ja) * | 1983-10-26 | 1985-05-24 | Nec Corp | 半導体装置 |
| JP4868273B2 (ja) * | 2003-08-11 | 2012-02-01 | 達也 鈴木 | ろうそく |
-
1971
- 1971-12-23 JP JP335372A patent/JPS5113611B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4870478A (cs) | 1973-09-25 |