JPS51131554A - Aqueous pispersion of resin curable at lower temperatures - Google Patents
Aqueous pispersion of resin curable at lower temperaturesInfo
- Publication number
- JPS51131554A JPS51131554A JP5477175A JP5477175A JPS51131554A JP S51131554 A JPS51131554 A JP S51131554A JP 5477175 A JP5477175 A JP 5477175A JP 5477175 A JP5477175 A JP 5477175A JP S51131554 A JPS51131554 A JP S51131554A
- Authority
- JP
- Japan
- Prior art keywords
- pispersion
- aqueous
- lower temperatures
- resin curable
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000013522 chelant Substances 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 235000014655 lactic acid Nutrition 0.000 abstract 1
- 239000004310 lactic acid Substances 0.000 abstract 1
- 239000003446 ligand Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The compn. capable of curing at lower temps. and producing transparent films with excellent resistance to chemicals, etc. comprises a specific aq. dispersion of a resin and a water-sol. Ti-chelate with lactic acid as ligand.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5477175A JPS51131554A (en) | 1975-05-12 | 1975-05-12 | Aqueous pispersion of resin curable at lower temperatures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5477175A JPS51131554A (en) | 1975-05-12 | 1975-05-12 | Aqueous pispersion of resin curable at lower temperatures |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51131554A true JPS51131554A (en) | 1976-11-16 |
JPS5533741B2 JPS5533741B2 (en) | 1980-09-02 |
Family
ID=12980020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5477175A Granted JPS51131554A (en) | 1975-05-12 | 1975-05-12 | Aqueous pispersion of resin curable at lower temperatures |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51131554A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118130A (en) * | 1984-11-14 | 1986-06-05 | Kao Corp | Aqueous dispersion stabilizer of fine-particle silica powder |
-
1975
- 1975-05-12 JP JP5477175A patent/JPS51131554A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118130A (en) * | 1984-11-14 | 1986-06-05 | Kao Corp | Aqueous dispersion stabilizer of fine-particle silica powder |
JPH0555179B2 (en) * | 1984-11-14 | 1993-08-16 | Kao Corp |
Also Published As
Publication number | Publication date |
---|---|
JPS5533741B2 (en) | 1980-09-02 |
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