JPS51131461A - A vacuum treatment chamber apparatus - Google Patents
A vacuum treatment chamber apparatusInfo
- Publication number
- JPS51131461A JPS51131461A JP5544075A JP5544075A JPS51131461A JP S51131461 A JPS51131461 A JP S51131461A JP 5544075 A JP5544075 A JP 5544075A JP 5544075 A JP5544075 A JP 5544075A JP S51131461 A JPS51131461 A JP S51131461A
- Authority
- JP
- Japan
- Prior art keywords
- treatment chamber
- chamber apparatus
- vacuum treatment
- vacuum
- leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009489 vacuum treatment Methods 0.000 title abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5544075A JPS51131461A (en) | 1975-05-13 | 1975-05-13 | A vacuum treatment chamber apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5544075A JPS51131461A (en) | 1975-05-13 | 1975-05-13 | A vacuum treatment chamber apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51131461A true JPS51131461A (en) | 1976-11-15 |
JPS5410350B2 JPS5410350B2 (enrdf_load_stackoverflow) | 1979-05-04 |
Family
ID=12998643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5544075A Granted JPS51131461A (en) | 1975-05-13 | 1975-05-13 | A vacuum treatment chamber apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51131461A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5385741A (en) * | 1977-01-07 | 1978-07-28 | Nippon Steel Corp | Continuous evaporation plating method of steel band |
JPS54153740A (en) * | 1978-05-25 | 1979-12-04 | Ulvac Corp | Continuous vacuum treatment apparatus |
JPS5511083A (en) * | 1978-04-07 | 1980-01-25 | Varian Associates | Spatter coating system and vacuum vale* transporter and spatter source arranging device for said system |
JPS5572028A (en) * | 1978-11-24 | 1980-05-30 | Ckd Corp | Device for dipping electrolyte of condenser |
US5562800A (en) * | 1993-09-20 | 1996-10-08 | Hitachi, Ltd. | Wafer transport method |
-
1975
- 1975-05-13 JP JP5544075A patent/JPS51131461A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5385741A (en) * | 1977-01-07 | 1978-07-28 | Nippon Steel Corp | Continuous evaporation plating method of steel band |
JPS5511083A (en) * | 1978-04-07 | 1980-01-25 | Varian Associates | Spatter coating system and vacuum vale* transporter and spatter source arranging device for said system |
JPS54153740A (en) * | 1978-05-25 | 1979-12-04 | Ulvac Corp | Continuous vacuum treatment apparatus |
JPS5572028A (en) * | 1978-11-24 | 1980-05-30 | Ckd Corp | Device for dipping electrolyte of condenser |
US5562800A (en) * | 1993-09-20 | 1996-10-08 | Hitachi, Ltd. | Wafer transport method |
US5601686A (en) * | 1993-09-20 | 1997-02-11 | Hitachi, Ltd. | Wafer transport method |
Also Published As
Publication number | Publication date |
---|---|
JPS5410350B2 (enrdf_load_stackoverflow) | 1979-05-04 |
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