JPS51131174U - - Google Patents
Info
- Publication number
- JPS51131174U JPS51131174U JP5172575U JP5172575U JPS51131174U JP S51131174 U JPS51131174 U JP S51131174U JP 5172575 U JP5172575 U JP 5172575U JP 5172575 U JP5172575 U JP 5172575U JP S51131174 U JPS51131174 U JP S51131174U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5172575U JPS51131174U (en) | 1975-04-15 | 1975-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5172575U JPS51131174U (en) | 1975-04-15 | 1975-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51131174U true JPS51131174U (en) | 1976-10-22 |
Family
ID=28197444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5172575U Pending JPS51131174U (en) | 1975-04-15 | 1975-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51131174U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170561U (en) * | 1981-04-20 | 1982-10-27 | ||
| JPS59134570A (en) * | 1983-01-24 | 1984-08-02 | Shin Kobe Electric Mach Co Ltd | Fuel cell structure |
| JPS59117156U (en) * | 1983-01-26 | 1984-08-07 | サンケン電気株式会社 | Insulator-encapsulated semiconductor device |
| JPS6371548U (en) * | 1987-10-02 | 1988-05-13 | ||
| JPS63315041A (en) * | 1987-06-19 | 1988-12-22 | Olympus Optical Co Ltd | Endoscope channel insert type ultrasonic probe |
-
1975
- 1975-04-15 JP JP5172575U patent/JPS51131174U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170561U (en) * | 1981-04-20 | 1982-10-27 | ||
| JPS59134570A (en) * | 1983-01-24 | 1984-08-02 | Shin Kobe Electric Mach Co Ltd | Fuel cell structure |
| JPS59117156U (en) * | 1983-01-26 | 1984-08-07 | サンケン電気株式会社 | Insulator-encapsulated semiconductor device |
| JPS63315041A (en) * | 1987-06-19 | 1988-12-22 | Olympus Optical Co Ltd | Endoscope channel insert type ultrasonic probe |
| JPS6371548U (en) * | 1987-10-02 | 1988-05-13 |