JPS51128471U - - Google Patents
Info
- Publication number
- JPS51128471U JPS51128471U JP1975049918U JP4991875U JPS51128471U JP S51128471 U JPS51128471 U JP S51128471U JP 1975049918 U JP1975049918 U JP 1975049918U JP 4991875 U JP4991875 U JP 4991875U JP S51128471 U JPS51128471 U JP S51128471U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975049918U JPS51128471U (enExample) | 1975-04-11 | 1975-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975049918U JPS51128471U (enExample) | 1975-04-11 | 1975-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51128471U true JPS51128471U (enExample) | 1976-10-16 |
Family
ID=28192497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975049918U Pending JPS51128471U (enExample) | 1975-04-11 | 1975-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51128471U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020081990A (ko) * | 2001-04-21 | 2002-10-30 | 한국 고덴시 주식회사 | 온도보상 기능을 갖는 발광소자 |
-
1975
- 1975-04-11 JP JP1975049918U patent/JPS51128471U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020081990A (ko) * | 2001-04-21 | 2002-10-30 | 한국 고덴시 주식회사 | 온도보상 기능을 갖는 발광소자 |