JPS5112771A - - Google Patents
Info
- Publication number
- JPS5112771A JPS5112771A JP49084365A JP8436574A JPS5112771A JP S5112771 A JPS5112771 A JP S5112771A JP 49084365 A JP49084365 A JP 49084365A JP 8436574 A JP8436574 A JP 8436574A JP S5112771 A JPS5112771 A JP S5112771A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49084365A JPS5112771A (en) | 1974-07-22 | 1974-07-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49084365A JPS5112771A (en) | 1974-07-22 | 1974-07-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5112771A true JPS5112771A (en) | 1976-01-31 |
Family
ID=13828488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49084365A Pending JPS5112771A (en) | 1974-07-22 | 1974-07-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5112771A (en) |
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1974
- 1974-07-22 JP JP49084365A patent/JPS5112771A/ja active Pending