JPS51121592U - - Google Patents
Info
- Publication number
- JPS51121592U JPS51121592U JP1975040695U JP4069575U JPS51121592U JP S51121592 U JPS51121592 U JP S51121592U JP 1975040695 U JP1975040695 U JP 1975040695U JP 4069575 U JP4069575 U JP 4069575U JP S51121592 U JPS51121592 U JP S51121592U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975040695U JPS51121592U (hr) | 1975-03-26 | 1975-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975040695U JPS51121592U (hr) | 1975-03-26 | 1975-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51121592U true JPS51121592U (hr) | 1976-10-01 |
Family
ID=28166777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975040695U Pending JPS51121592U (hr) | 1975-03-26 | 1975-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51121592U (hr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11503880A (ja) * | 1996-02-09 | 1999-03-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 半導体材料のウエファに形成された半導体素子のレーザ分割方法 |
| JP2015159297A (ja) * | 2011-06-15 | 2015-09-03 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | マルチステップ・非対称形状レーザビームスクライビング |
| JP2018018907A (ja) * | 2016-07-26 | 2018-02-01 | 株式会社ディスコ | デバイスウエーハの加工方法 |
-
1975
- 1975-03-26 JP JP1975040695U patent/JPS51121592U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11503880A (ja) * | 1996-02-09 | 1999-03-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 半導体材料のウエファに形成された半導体素子のレーザ分割方法 |
| JP2015159297A (ja) * | 2011-06-15 | 2015-09-03 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | マルチステップ・非対称形状レーザビームスクライビング |
| JP2018018907A (ja) * | 2016-07-26 | 2018-02-01 | 株式会社ディスコ | デバイスウエーハの加工方法 |