JPS5111890A - FUHOWAHORIESUTERUJUSHISOSEIBUTSUNO SEIZOHOHO - Google Patents
FUHOWAHORIESUTERUJUSHISOSEIBUTSUNO SEIZOHOHOInfo
- Publication number
- JPS5111890A JPS5111890A JP8230974A JP8230974A JPS5111890A JP S5111890 A JPS5111890 A JP S5111890A JP 8230974 A JP8230974 A JP 8230974A JP 8230974 A JP8230974 A JP 8230974A JP S5111890 A JPS5111890 A JP S5111890A
- Authority
- JP
- Japan
- Prior art keywords
- fuhowahoriesuterujushisoseibutsuno
- seizohoho
- fuhowahoriesuterujushisoseibutsuno seizohoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8230974A JPS5111890A (en) | 1974-07-19 | 1974-07-19 | FUHOWAHORIESUTERUJUSHISOSEIBUTSUNO SEIZOHOHO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8230974A JPS5111890A (en) | 1974-07-19 | 1974-07-19 | FUHOWAHORIESUTERUJUSHISOSEIBUTSUNO SEIZOHOHO |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5111890A true JPS5111890A (en) | 1976-01-30 |
JPS5413278B2 JPS5413278B2 (en) | 1979-05-29 |
Family
ID=13770944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8230974A Granted JPS5111890A (en) | 1974-07-19 | 1974-07-19 | FUHOWAHORIESUTERUJUSHISOSEIBUTSUNO SEIZOHOHO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5111890A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5422485A (en) * | 1977-07-22 | 1979-02-20 | Teijin Ltd | Molding resin composition having low dielectric constant |
-
1974
- 1974-07-19 JP JP8230974A patent/JPS5111890A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5422485A (en) * | 1977-07-22 | 1979-02-20 | Teijin Ltd | Molding resin composition having low dielectric constant |
JPS579576B2 (en) * | 1977-07-22 | 1982-02-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS5413278B2 (en) | 1979-05-29 |
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