JPS5111475B1 - - Google Patents

Info

Publication number
JPS5111475B1
JPS5111475B1 JP42061666A JP6166667A JPS5111475B1 JP S5111475 B1 JPS5111475 B1 JP S5111475B1 JP 42061666 A JP42061666 A JP 42061666A JP 6166667 A JP6166667 A JP 6166667A JP S5111475 B1 JPS5111475 B1 JP S5111475B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP42061666A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP42061666A priority Critical patent/JPS5111475B1/ja
Priority to US742292A priority patent/US3648121A/en
Priority to FR1579178D priority patent/FR1579178A/fr
Priority to DE1764872A priority patent/DE1764872C3/en
Priority to NL686812708A priority patent/NL148744B/en
Priority to GB03602/71A priority patent/GB1246668A/en
Priority to GB36505/68A priority patent/GB1246667A/en
Priority to US00059853A priority patent/US3715802A/en
Priority to US00286130A priority patent/US3818584A/en
Publication of JPS5111475B1 publication Critical patent/JPS5111475B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP42061666A 1967-09-06 1967-09-27 Pending JPS5111475B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP42061666A JPS5111475B1 (en) 1967-09-27 1967-09-27
US742292A US3648121A (en) 1967-09-06 1968-07-03 A laminated semiconductor structure
FR1579178D FR1579178A (en) 1967-09-06 1968-08-21
DE1764872A DE1764872C3 (en) 1967-09-06 1968-08-22 Process for the manufacture of semiconductor rectifiers
NL686812708A NL148744B (en) 1967-09-06 1968-09-06 PROCEDURE FOR THE MANUFACTURE OF A SYSTEM OF SEMICONDUCTIVE ELEMENTS AND SYSTEMS OBTAINED AND SMALLER SYSTEMS AND SEPARATE SEMICONDUCTIVE ELEMENTS MANUFACTURED THEREOF.
GB03602/71A GB1246668A (en) 1967-09-06 1968-09-06 Semiconductor assemblies and a method for manufacturing semiconductor assemblies
GB36505/68A GB1246667A (en) 1967-09-06 1968-09-06 Semiconductor apparatus and method for manufacturing semiconductor apparatus
US00059853A US3715802A (en) 1967-09-06 1970-06-25 Semiconductor apparatus and method for manufacturing the same
US00286130A US3818584A (en) 1967-09-06 1972-09-05 Method for manufacturing a semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP42061666A JPS5111475B1 (en) 1967-09-27 1967-09-27

Publications (1)

Publication Number Publication Date
JPS5111475B1 true JPS5111475B1 (en) 1976-04-12

Family

ID=13177764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP42061666A Pending JPS5111475B1 (en) 1967-09-06 1967-09-27

Country Status (1)

Country Link
JP (1) JPS5111475B1 (en)

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