JPS51112459U - - Google Patents
Info
- Publication number
- JPS51112459U JPS51112459U JP3169275U JP3169275U JPS51112459U JP S51112459 U JPS51112459 U JP S51112459U JP 3169275 U JP3169275 U JP 3169275U JP 3169275 U JP3169275 U JP 3169275U JP S51112459 U JPS51112459 U JP S51112459U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169275U JPS5529242Y2 (pt) | 1975-03-08 | 1975-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169275U JPS5529242Y2 (pt) | 1975-03-08 | 1975-03-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51112459U true JPS51112459U (pt) | 1976-09-11 |
| JPS5529242Y2 JPS5529242Y2 (pt) | 1980-07-11 |
Family
ID=28141440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3169275U Expired JPS5529242Y2 (pt) | 1975-03-08 | 1975-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5529242Y2 (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60247955A (ja) * | 1984-04-02 | 1985-12-07 | バロ−ス・コ−ポレ−シヨン | 集積回路ダイの電子機械的アセンブリ |
-
1975
- 1975-03-08 JP JP3169275U patent/JPS5529242Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60247955A (ja) * | 1984-04-02 | 1985-12-07 | バロ−ス・コ−ポレ−シヨン | 集積回路ダイの電子機械的アセンブリ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5529242Y2 (pt) | 1980-07-11 |