JPS51110970A - Handotaisochinoseiho - Google Patents
HandotaisochinoseihoInfo
- Publication number
- JPS51110970A JPS51110970A JP3619675A JP3619675A JPS51110970A JP S51110970 A JPS51110970 A JP S51110970A JP 3619675 A JP3619675 A JP 3619675A JP 3619675 A JP3619675 A JP 3619675A JP S51110970 A JPS51110970 A JP S51110970A
- Authority
- JP
- Japan
- Prior art keywords
- handotaisochinoseiho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Bipolar Transistors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50036196A JPS5915488B2 (ja) | 1975-03-25 | 1975-03-25 | 半導体装置の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50036196A JPS5915488B2 (ja) | 1975-03-25 | 1975-03-25 | 半導体装置の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51110970A true JPS51110970A (en) | 1976-09-30 |
| JPS5915488B2 JPS5915488B2 (ja) | 1984-04-10 |
Family
ID=12462963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50036196A Expired JPS5915488B2 (ja) | 1975-03-25 | 1975-03-25 | 半導体装置の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5915488B2 (enExample) |
-
1975
- 1975-03-25 JP JP50036196A patent/JPS5915488B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5915488B2 (ja) | 1984-04-10 |