JPS51109773A - Handotaisochi - Google Patents

Handotaisochi

Info

Publication number
JPS51109773A
JPS51109773A JP3385175A JP3385175A JPS51109773A JP S51109773 A JPS51109773 A JP S51109773A JP 3385175 A JP3385175 A JP 3385175A JP 3385175 A JP3385175 A JP 3385175A JP S51109773 A JPS51109773 A JP S51109773A
Authority
JP
Japan
Prior art keywords
handota
isochi
handota isochi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3385175A
Other languages
English (en)
Japanese (ja)
Other versions
JPS557941B2 (enrdf_load_stackoverflow
Inventor
Kaname Ootaki
Kozo Yamagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3385175A priority Critical patent/JPS51109773A/ja
Publication of JPS51109773A publication Critical patent/JPS51109773A/ja
Publication of JPS557941B2 publication Critical patent/JPS557941B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Die Bonding (AREA)
JP3385175A 1975-03-20 1975-03-20 Handotaisochi Granted JPS51109773A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3385175A JPS51109773A (ja) 1975-03-20 1975-03-20 Handotaisochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3385175A JPS51109773A (ja) 1975-03-20 1975-03-20 Handotaisochi

Publications (2)

Publication Number Publication Date
JPS51109773A true JPS51109773A (ja) 1976-09-28
JPS557941B2 JPS557941B2 (enrdf_load_stackoverflow) 1980-02-29

Family

ID=12397997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3385175A Granted JPS51109773A (ja) 1975-03-20 1975-03-20 Handotaisochi

Country Status (1)

Country Link
JP (1) JPS51109773A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0965278A1 (en) * 1998-06-16 1999-12-22 Mathias Christian Zohoungbogbo Dietetic food composition and dietetic method using such composition

Also Published As

Publication number Publication date
JPS557941B2 (enrdf_load_stackoverflow) 1980-02-29

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