JPS51107259U - - Google Patents

Info

Publication number
JPS51107259U
JPS51107259U JP2565075U JP2565075U JPS51107259U JP S51107259 U JPS51107259 U JP S51107259U JP 2565075 U JP2565075 U JP 2565075U JP 2565075 U JP2565075 U JP 2565075U JP S51107259 U JPS51107259 U JP S51107259U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2565075U
Other languages
Japanese (ja)
Other versions
JPS5442617Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975025650U priority Critical patent/JPS5442617Y2/ja
Publication of JPS51107259U publication Critical patent/JPS51107259U/ja
Application granted granted Critical
Publication of JPS5442617Y2 publication Critical patent/JPS5442617Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1975025650U 1975-02-24 1975-02-24 Expired JPS5442617Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975025650U JPS5442617Y2 (enrdf_load_stackoverflow) 1975-02-24 1975-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975025650U JPS5442617Y2 (enrdf_load_stackoverflow) 1975-02-24 1975-02-24

Publications (2)

Publication Number Publication Date
JPS51107259U true JPS51107259U (enrdf_load_stackoverflow) 1976-08-27
JPS5442617Y2 JPS5442617Y2 (enrdf_load_stackoverflow) 1979-12-11

Family

ID=28124537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975025650U Expired JPS5442617Y2 (enrdf_load_stackoverflow) 1975-02-24 1975-02-24

Country Status (1)

Country Link
JP (1) JPS5442617Y2 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (enrdf_load_stackoverflow) * 1972-09-08 1974-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (enrdf_load_stackoverflow) * 1972-09-08 1974-05-07

Also Published As

Publication number Publication date
JPS5442617Y2 (enrdf_load_stackoverflow) 1979-12-11

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