JPS51106225U - - Google Patents
Info
- Publication number
- JPS51106225U JPS51106225U JP2492075U JP2492075U JPS51106225U JP S51106225 U JPS51106225 U JP S51106225U JP 2492075 U JP2492075 U JP 2492075U JP 2492075 U JP2492075 U JP 2492075U JP S51106225 U JPS51106225 U JP S51106225U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2492075U JPS5347067Y2 (de) | 1975-02-21 | 1975-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2492075U JPS5347067Y2 (de) | 1975-02-21 | 1975-02-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51106225U true JPS51106225U (de) | 1976-08-25 |
| JPS5347067Y2 JPS5347067Y2 (de) | 1978-11-10 |
Family
ID=28122519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2492075U Expired JPS5347067Y2 (de) | 1975-02-21 | 1975-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5347067Y2 (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013220477A (ja) * | 2012-04-17 | 2013-10-28 | Hakko Kk | ソルダリングアセンブリ |
| JP2016087661A (ja) * | 2014-11-06 | 2016-05-23 | 白光株式会社 | ハンダコテ及びこれに用いられるパイプ付きコテ先 |
| WO2021004752A1 (de) * | 2019-07-09 | 2021-01-14 | Endress+Hauser SE+Co. KG | Stift zum übertragen von lotpaste aus einem reservoir auf eine kontaktstelle einer leiterplatte; verfahren zur herstellung dieses stiftes, und verwendung dieses stiftes in einem verfahren zur reparatur einer leiterplatte |
-
1975
- 1975-02-21 JP JP2492075U patent/JPS5347067Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013220477A (ja) * | 2012-04-17 | 2013-10-28 | Hakko Kk | ソルダリングアセンブリ |
| JP2016087661A (ja) * | 2014-11-06 | 2016-05-23 | 白光株式会社 | ハンダコテ及びこれに用いられるパイプ付きコテ先 |
| WO2021004752A1 (de) * | 2019-07-09 | 2021-01-14 | Endress+Hauser SE+Co. KG | Stift zum übertragen von lotpaste aus einem reservoir auf eine kontaktstelle einer leiterplatte; verfahren zur herstellung dieses stiftes, und verwendung dieses stiftes in einem verfahren zur reparatur einer leiterplatte |
| CN114080867A (zh) * | 2019-07-09 | 2022-02-22 | 恩德莱斯和豪瑟尔欧洲两合公司 | 用于将焊膏从储备器转移到电路板的接触部位上的笔、用于制造这种笔的方法及这种笔在用于修复电路板的方法中的应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5347067Y2 (de) | 1978-11-10 |