JPS51105833A - - Google Patents
Info
- Publication number
- JPS51105833A JPS51105833A JP50150078A JP15007875A JPS51105833A JP S51105833 A JPS51105833 A JP S51105833A JP 50150078 A JP50150078 A JP 50150078A JP 15007875 A JP15007875 A JP 15007875A JP S51105833 A JPS51105833 A JP S51105833A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/34—Structure of thermal heads comprising semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
- H01L27/0211—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique adapted for requirements of temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0744—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
- H01L27/075—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US533427 | 1974-12-16 | ||
US05/533,427 US3988569A (en) | 1974-12-16 | 1974-12-16 | Thermal printhead with memory |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51105833A true JPS51105833A (ja) | 1976-09-20 |
JPS6055315B2 JPS6055315B2 (ja) | 1985-12-04 |
Family
ID=24125912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50150078A Expired JPS6055315B2 (ja) | 1974-12-16 | 1975-12-16 | サーマル・プリントヘツド |
Country Status (5)
Country | Link |
---|---|
US (1) | US3988569A (ja) |
JP (1) | JPS6055315B2 (ja) |
DE (1) | DE2556655A1 (ja) |
FR (1) | FR2294853A1 (ja) |
GB (1) | GB1527257A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59146873A (ja) * | 1983-02-10 | 1984-08-22 | Rohm Co Ltd | サ−マルプリンタヘツド用駆動回路 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4141017A (en) * | 1977-02-03 | 1979-02-20 | Texas Instruments Incorporated | Thermal printer having expanded character set thermal printhead |
US4259676A (en) * | 1979-07-30 | 1981-03-31 | Santek, Inc. | Thermal print head |
USRE32897E (en) * | 1979-07-30 | 1989-03-28 | Kyocera Corporation | Thermal print head |
US4594501A (en) * | 1980-10-09 | 1986-06-10 | Texas Instruments Incorporated | Pulse width modulation of printhead voltage |
US4394092A (en) * | 1981-12-21 | 1983-07-19 | Ncr Canada Ltd. - Ncr Canada Ltee | Method and apparatus for high speed thermal printing |
US4523235A (en) * | 1982-01-11 | 1985-06-11 | Jan Rajchman | Electronic microcopier apparatus |
CA1237019A (en) * | 1984-03-26 | 1988-05-24 | Toshio Matsuzaki | Thermal recording head and process for manufacturing wiring substrate therefor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3385957A (en) * | 1965-08-02 | 1968-05-28 | Mallory & Co Inc P R | Electronically controlled heater |
US3501615A (en) * | 1967-09-29 | 1970-03-17 | Texas Instruments Inc | Integrated heater element array and drive matrix |
US3467810A (en) * | 1967-10-02 | 1969-09-16 | Ncr Co | Thermal printing selection circuitry |
US3566162A (en) * | 1968-02-12 | 1971-02-23 | Lynch Communication Systems | Gating circuit |
-
1974
- 1974-12-16 US US05/533,427 patent/US3988569A/en not_active Expired - Lifetime
-
1975
- 1975-12-12 GB GB51038/75A patent/GB1527257A/en not_active Expired
- 1975-12-15 FR FR7538379A patent/FR2294853A1/fr active Granted
- 1975-12-16 JP JP50150078A patent/JPS6055315B2/ja not_active Expired
- 1975-12-16 DE DE19752556655 patent/DE2556655A1/de not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59146873A (ja) * | 1983-02-10 | 1984-08-22 | Rohm Co Ltd | サ−マルプリンタヘツド用駆動回路 |
Also Published As
Publication number | Publication date |
---|---|
FR2294853B1 (ja) | 1982-12-10 |
FR2294853A1 (fr) | 1976-07-16 |
GB1527257A (en) | 1978-10-04 |
JPS6055315B2 (ja) | 1985-12-04 |
DE2556655A1 (de) | 1976-07-01 |
US3988569A (en) | 1976-10-26 |