JPS51100685A - - Google Patents

Info

Publication number
JPS51100685A
JPS51100685A JP2560475A JP2560475A JPS51100685A JP S51100685 A JPS51100685 A JP S51100685A JP 2560475 A JP2560475 A JP 2560475A JP 2560475 A JP2560475 A JP 2560475A JP S51100685 A JPS51100685 A JP S51100685A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2560475A
Other languages
Japanese (ja)
Inventor
Ryozo Furukawa
Masayasu Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP2560475A priority Critical patent/JPS51100685A/ja
Publication of JPS51100685A publication Critical patent/JPS51100685A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Led Devices (AREA)
JP2560475A 1975-03-04 1975-03-04 Pending JPS51100685A (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2560475A JPS51100685A (enrdf_load_html_response) 1975-03-04 1975-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2560475A JPS51100685A (enrdf_load_html_response) 1975-03-04 1975-03-04

Publications (1)

Publication Number Publication Date
JPS51100685A true JPS51100685A (enrdf_load_html_response) 1976-09-06

Family

ID=12170497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2560475A Pending JPS51100685A (enrdf_load_html_response) 1975-03-04 1975-03-04

Country Status (1)

Country Link
JP (1) JPS51100685A (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140284A (enrdf_load_html_response) * 1974-04-27 1975-11-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140284A (enrdf_load_html_response) * 1974-04-27 1975-11-10

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