JPS5098274A - - Google Patents
Info
- Publication number
- JPS5098274A JPS5098274A JP48144120A JP14412073A JPS5098274A JP S5098274 A JPS5098274 A JP S5098274A JP 48144120 A JP48144120 A JP 48144120A JP 14412073 A JP14412073 A JP 14412073A JP S5098274 A JPS5098274 A JP S5098274A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5363—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48144120A JPS5225297B2 (cg-RX-API-DMAC10.html) | 1973-12-26 | 1973-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48144120A JPS5225297B2 (cg-RX-API-DMAC10.html) | 1973-12-26 | 1973-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5098274A true JPS5098274A (cg-RX-API-DMAC10.html) | 1975-08-05 |
| JPS5225297B2 JPS5225297B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |
Family
ID=15354643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48144120A Expired JPS5225297B2 (cg-RX-API-DMAC10.html) | 1973-12-26 | 1973-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5225297B2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163843U (cg-RX-API-DMAC10.html) * | 1984-09-28 | 1986-04-30 | ||
| US5841190A (en) * | 1995-05-19 | 1998-11-24 | Ibiden Co., Ltd. | High density multi-layered printed wiring board, multi-chip carrier and semiconductor package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5557911U (cg-RX-API-DMAC10.html) * | 1978-10-16 | 1980-04-19 |
-
1973
- 1973-12-26 JP JP48144120A patent/JPS5225297B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163843U (cg-RX-API-DMAC10.html) * | 1984-09-28 | 1986-04-30 | ||
| US5841190A (en) * | 1995-05-19 | 1998-11-24 | Ibiden Co., Ltd. | High density multi-layered printed wiring board, multi-chip carrier and semiconductor package |
| WO2004100260A1 (ja) * | 1995-05-19 | 2004-11-18 | Kouta Noda | 高密度多層プリント配線版、マルチチップキャリア及び半導体パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5225297B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |