JPS509757A - - Google Patents
Info
- Publication number
- JPS509757A JPS509757A JP6143673A JP6143673A JPS509757A JP S509757 A JPS509757 A JP S509757A JP 6143673 A JP6143673 A JP 6143673A JP 6143673 A JP6143673 A JP 6143673A JP S509757 A JPS509757 A JP S509757A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6143673A JPS509757A (enExample) | 1973-06-02 | 1973-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6143673A JPS509757A (enExample) | 1973-06-02 | 1973-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS509757A true JPS509757A (enExample) | 1975-01-31 |
Family
ID=13171002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6143673A Pending JPS509757A (enExample) | 1973-06-02 | 1973-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS509757A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146791A (ja) * | 1988-11-28 | 1990-06-05 | Mitsubishi Mining & Cement Co Ltd | 混成集積回路用多層配線回路を有するハーメチックパッケージ構造体およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3549784A (en) * | 1968-02-01 | 1970-12-22 | American Lava Corp | Ceramic-metallic composite substrate |
-
1973
- 1973-06-02 JP JP6143673A patent/JPS509757A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3549784A (en) * | 1968-02-01 | 1970-12-22 | American Lava Corp | Ceramic-metallic composite substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146791A (ja) * | 1988-11-28 | 1990-06-05 | Mitsubishi Mining & Cement Co Ltd | 混成集積回路用多層配線回路を有するハーメチックパッケージ構造体およびその製造方法 |