JPS5094884A - - Google Patents
Info
- Publication number
- JPS5094884A JPS5094884A JP14400174A JP14400174A JPS5094884A JP S5094884 A JPS5094884 A JP S5094884A JP 14400174 A JP14400174 A JP 14400174A JP 14400174 A JP14400174 A JP 14400174A JP S5094884 A JPS5094884 A JP S5094884A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2362353A DE2362353A1 (en) | 1973-12-14 | 1973-12-14 | Heat sink for semiconductor component - has massive core column with component receiving surface and lateral cooling fins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5094884A true JPS5094884A (en) | 1975-07-28 |
| JPS5421713B2 JPS5421713B2 (en) | 1979-08-01 |
Family
ID=5900832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14400174A Expired JPS5421713B2 (en) | 1973-12-14 | 1974-12-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5421713B2 (en) |
| DE (1) | DE2362353A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622253U (en) * | 1985-06-20 | 1987-01-08 | ||
| US6735864B2 (en) | 2000-01-26 | 2004-05-18 | Matsushita Electric Industrial Co., Ltd. | Heatsink method of manufacturing the same and cooling apparatus using the same |
| US7040388B1 (en) | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3005505C2 (en) * | 1980-02-14 | 1985-04-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Heat sink block for semiconductor wafer cells with attached molded parts made of insulating plastic |
| CH656696A5 (en) * | 1981-06-25 | 1986-07-15 | Alusuisse | METHOD AND DEVICE FOR INTENSE HEAT AND / OR MASS TRANSFER, PARTICULARLY IN furnaces. |
| FI970480A (en) * | 1997-02-05 | 1998-08-06 | Abb Industry Oy | Heat sink |
| TWM254653U (en) * | 2004-03-26 | 2005-01-01 | Chia Cherne Industry Co Ltd | Novel tilted heat sink structure of composite type |
-
1973
- 1973-12-14 DE DE2362353A patent/DE2362353A1/en active Pending
-
1974
- 1974-12-13 JP JP14400174A patent/JPS5421713B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622253U (en) * | 1985-06-20 | 1987-01-08 | ||
| US7040388B1 (en) | 2000-01-14 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Heat sink, method of manufacturing the same and cooling apparatus using the same |
| US6735864B2 (en) | 2000-01-26 | 2004-05-18 | Matsushita Electric Industrial Co., Ltd. | Heatsink method of manufacturing the same and cooling apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2362353A1 (en) | 1975-06-26 |
| JPS5421713B2 (en) | 1979-08-01 |