JPS5092683A - - Google Patents

Info

Publication number
JPS5092683A
JPS5092683A JP13865473A JP13865473A JPS5092683A JP S5092683 A JPS5092683 A JP S5092683A JP 13865473 A JP13865473 A JP 13865473A JP 13865473 A JP13865473 A JP 13865473A JP S5092683 A JPS5092683 A JP S5092683A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13865473A
Other languages
Japanese (ja)
Other versions
JPS52675B2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13865473A priority Critical patent/JPS52675B2/ja
Publication of JPS5092683A publication Critical patent/JPS5092683A/ja
Publication of JPS52675B2 publication Critical patent/JPS52675B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Die Bonding (AREA)
  • Rectifiers (AREA)
JP13865473A 1973-12-14 1973-12-14 Expired JPS52675B2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13865473A JPS52675B2 (fr) 1973-12-14 1973-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13865473A JPS52675B2 (fr) 1973-12-14 1973-12-14

Publications (2)

Publication Number Publication Date
JPS5092683A true JPS5092683A (fr) 1975-07-24
JPS52675B2 JPS52675B2 (fr) 1977-01-10

Family

ID=15227019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13865473A Expired JPS52675B2 (fr) 1973-12-14 1973-12-14

Country Status (1)

Country Link
JP (1) JPS52675B2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143571U (fr) * 1974-09-25 1976-03-31
US5037334A (en) * 1990-11-30 1991-08-06 Amp Corporated Connector with equal lateral force contact spacer plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143571U (fr) * 1974-09-25 1976-03-31
US5037334A (en) * 1990-11-30 1991-08-06 Amp Corporated Connector with equal lateral force contact spacer plate

Also Published As

Publication number Publication date
JPS52675B2 (fr) 1977-01-10

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