JPS5091277A - - Google Patents
Info
- Publication number
- JPS5091277A JPS5091277A JP48137799A JP13779973A JPS5091277A JP S5091277 A JPS5091277 A JP S5091277A JP 48137799 A JP48137799 A JP 48137799A JP 13779973 A JP13779973 A JP 13779973A JP S5091277 A JPS5091277 A JP S5091277A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48137799A JPS5242668B2 (enExample) | 1973-12-12 | 1973-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48137799A JPS5242668B2 (enExample) | 1973-12-12 | 1973-12-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5091277A true JPS5091277A (enExample) | 1975-07-21 |
| JPS5242668B2 JPS5242668B2 (enExample) | 1977-10-26 |
Family
ID=15207107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48137799A Expired JPS5242668B2 (enExample) | 1973-12-12 | 1973-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5242668B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258953U (enExample) * | 1975-10-27 | 1977-04-28 |
-
1973
- 1973-12-12 JP JP48137799A patent/JPS5242668B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258953U (enExample) * | 1975-10-27 | 1977-04-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5242668B2 (enExample) | 1977-10-26 |