JPS509071A - - Google Patents
Info
- Publication number
- JPS509071A JPS509071A JP6069173A JP6069173A JPS509071A JP S509071 A JPS509071 A JP S509071A JP 6069173 A JP6069173 A JP 6069173A JP 6069173 A JP6069173 A JP 6069173A JP S509071 A JPS509071 A JP S509071A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6069173A JPS5534585B2 (enExample) | 1973-05-30 | 1973-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6069173A JPS5534585B2 (enExample) | 1973-05-30 | 1973-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS509071A true JPS509071A (enExample) | 1975-01-30 |
| JPS5534585B2 JPS5534585B2 (enExample) | 1980-09-08 |
Family
ID=13149564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6069173A Expired JPS5534585B2 (enExample) | 1973-05-30 | 1973-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5534585B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60233886A (ja) * | 1984-05-02 | 1985-11-20 | 日立エーアイシー株式会社 | 印刷配線板の製造方法 |
-
1973
- 1973-05-30 JP JP6069173A patent/JPS5534585B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60233886A (ja) * | 1984-05-02 | 1985-11-20 | 日立エーアイシー株式会社 | 印刷配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5534585B2 (enExample) | 1980-09-08 |